MICRONOX MX2376 is a semi-aqueous solvent blend cleaning agent that designed to remove tough No-clean/RMA flux residues. It provides excellent compatibility on sensitive metals such as Cu, Ag and high Pb alloys from power electronics including PMICs, discretes and power modules. MX2376 is effective in ultrasonic immersion cleaning systems and reserves superior Cu leadframe or Cu DBC surface for post wire bonding and molding processes.
Product Data
Application: Ultrasonic
Application: Ultrasonic
Typical Process
Process: Ultrasonic
Concentration: 100%
Temperature: 130°F / 55°C
Rinse: DI Water Rinse
Dry: Hot Air
Product Properties
pH (10g/L): 10.5
Flash Point: None to 230°F / 110°C
Boiling Point: 270°F / 132°C
Water Soluble: Partially Soluble
VOC, @ 100% 857 g/L
NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.
