MICRONOX MX2123 is an aqueous, multi-phase and well-balanced chemistry designed to remove flux residues from all types of IGBT module devices that utilize a mix of copper, silver and nickel DBC as substrates, as well as PCBs. With well-balanced formula, MX2123 leaves great surface conditions for post wire bond and potting processes as well as retains anti-oxidation materials (Organic Solderability Preservative or OSP) to protect base metals after cleaning. It is effective at low temperature, low concentration and easily monitored in in-line SIA cleaning system or Ultrasonic Immersion cleaning system.
DBC device exposed metalization is susceptible to cleaning agent attack on the copper and nickel substrates. MICRONOX MX2123 effectively cleans flux residues present after the die-attach process. The low level of free alkalinity in combination with corrosion inhibition technology protects exposed metals from cleaning agent attack while still allowing high yields for post-cleaning wire bonding. MX2123 also offers longer bath life at low concentrations.
Application: IGBT Module Devices
NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.
