MICRONOX MX2100 is an aqueous, single-phase cleaner designed to remove all types of flux residue including both water soluble and no-clean fluxes commonly used in flip chip packaging and systemin-packaging processes. With a balanced formula, MX2100 is compatible with a wide range of materials such as SAC alloys, PI materials and solder masks. MICRONOX MX2100 is cost-effective, easy to rinse and monitor. It is also effective on both Inline Spray-in-Air and ultrasonic immersion clean systems.
MICRONOX MX2100 intermolecular attractive forces for polar and non-polar organic acid flux residues allow for rapid dissolution of the flux residue and makes it as a universal cleaner for flip chip packaging and SiP devices. The low level of free alkalinity in combination with corrosion inhibition technology protects exposed metals from cleaning agent attack.
Application: Flip Chips Cleaning
NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.